The Challenges of On-Device AI Development and Yes, AI Can Predict the Rain Better than the Weatherman

Artificial Intelligence reigns supreme in this week’s Fish Fry podcast! First up, we take a closer look at DeepMind’s new foray into rainfall prediction. We investigate how DeepMind’s deep generative model of rain tool supports the advancement of precipitation nowcasting and how it compares to current methods of precipitation forecasting. Keeping with our AI theme this week, Pulin Desai (Cadence Design Systems) … Read More → "The Challenges of On-Device AI Development and Yes, AI Can Predict the Rain Better than the Weatherman"

Mega-Cool Laser-Based Sub-Jellybean-Sized Multizone Ranging Sensor

I’ve just been playing with one of the new VL53L5CX Time-of-Flight 8×8 Multizone Ranging Sensors from STMicroelectronics. On the bright side (no pun intended), this involved a laser beam bouncing all around my office. Sad to relate, however, I couldn’t see it because it was outside the range of human vision.

I tell you — every day I’ … Read More → "Mega-Cool Laser-Based Sub-Jellybean-Sized Multizone Ranging Sensor"

Intel’s Stuart Pann Explains the Company’s use of Outside Foundries

Stuart Pann, Senior Vice President of Intel’s Corporate Planning Group, published an interesting “opinion” piece titled “Expanding Intel’s Foundry Partnerships: A Critical Piece of IDM 2.0” in August. “IDM 2.0” is the term Intel uses to describe its use of process technologies from other foundries in addition to Intel’s home-grown process technologies. The term “IDM” means “integrated device manufacturer” and refers to a chipmaker that manufactures its own silicon die. … Read More → "Intel’s Stuart Pann Explains the Company’s use of Outside Foundries"

Samsung’s 50-Mpixel GN2 Image Sensor Sports Pro Camera Features

In August, at the Hot Chips 33 conference, held online this year thanks to COVID-19, Sooki Yoon described the Samsung 50-Mpixel GN2 image sensor, which the company announced earlier this year. This sensor is destined to be used in mobile phones such as the Xiaomi Mi 11 Ultra/Pro, according … Read More → "Samsung’s 50-Mpixel GN2 Image Sensor Sports Pro Camera Features"

Eyes on the Prize: element14’s Spy Nerd Challenge and MIT’s New Robot Finds Lost Items

In this week’s podcast, we start things off with a closer look at a new robotic system developed by a team of researchers at MIT called RFusion. We investigate how it combines RF information, visual data, and neural networks to find and retrieve objects with ease. (Spoiler alert: it can even find objects when they are buried under a pile and fully out of view.) Also … Read More → "Eyes on the Prize: element14’s Spy Nerd Challenge and MIT’s New Robot Finds Lost Items"

October 15, 2021
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featured chalk talk

In-Chip Sensing and PVT Monitoring

Sponsored by Synopsys

In-chip monitoring can significantly alter the lifecycle management landscape. By taking advantage of modern techniques, today’s more complex designs can be optimized even after they are deployed. In this episode of Chalk Talk, Amelia Dalton chats with Stephen Crosher of Synopsys about silicon lifecycle management and how to take full advantage of the optimization opportunities available for scalability, reliability, and much more.

Click here for more information about in-chip monitoring and sensing

featured paper

3 ways to speed cycle time when designing with brushless-DC motors

Sponsored by Texas Instruments

Designing systems with BLDC motors can be challenging, because it usually requires complex hardware and optimized software designs to deliver reliable real-time control. This article discusses three methods for simplifying the process.

Click to read more

featured video

Intel Architecture Day 2021: Data Center - Infrastructure Processing Unit

Sponsored by Intel

Intel unveiled its biggest architectural shifts in a generation for CPUs, GPUs and IPUs to satisfy the crushing demand for more compute performance at Architecture Day 2021. Guido Appenzeller, Chief Technology Officer of Intel's Data Platforms Group explains how the IPU's design enables cloud and communication service providers to reduce overhead and free up performance for central processing units.

Click here to learn more

Posted on Oct 14 at 4:23am by kdoherty99
A nice article covering the latest shortage. There is one aspect of this shortage I have not seen covered in the various articles I've seen so far. The gaining trend to push older IC's into premature obsolescense by the FABs and chip suppliers. This trend is picking up and seems ...
Posted on Oct 12 at 10:56am by gene plichota
there are those of us who object in principle to the way info is organized and presented by the design of our infosphere....much like principled vax-refusers, we stand on our right to not chow down on what's put before us and don't engage farther than is necessary what's wrong ...
Posted on Oct 6 at 4:08pm by Scott V.
There is absolutely no reason to fabricate most semiconductors on a fine pitch process where a mask set to make the chip can literally cost millions of dollars. Most Diodes, Discrete Transitors, Mofets and other power semiconductors can and are fabricated on much older processes that have been around for ...
Posted on Oct 4 at 2:02pm by MartinCroome
We ran out of toilet paper thanks to panic buying! What makes people think that semiconductors are somehow different? Hit it in a nut shell. Stupid purchasing managers in cars manufacturers -> Smart purchasing managers in consumer goods manufacturers -> Panic
Posted on Oct 1 at 6:54am by John
Ha, I too was born in 1957 and my career councillor gave the same advice and, like you, I hated all that theory; I wanted to make things. I hope CCs today look deeper into matching the candidate with the course.
Posted on Sep 29 at 8:00am by Karl Stevens
Here is a pdf that led to Project Catapult that put FPGAs in the Microsoft Data Centers. It does not seem to fit the reasoning in this article. Because the performance gain justifies the cost and adds programmability to the FPGA in spite of all the stated reasons to not ...
Posted on Sep 24 at 11:38am by Karl Stevens
metaprog wrote " You still have to design those cores using HDLs or at least an HLS." Indeed you do! And to me, that is a major problem. A system is a collection of interconnected blocks that communicate using interfaces that have control signals and usually data that is moved between ...
Posted on Sep 23 at 3:19pm by metaprog
Python in Pynq is used not as a replacement for HDLs, but as an easy tool for talking to AXI IPs from a PS side of your SoC. It is reading .hwh files and infering how to access your IP cores registers from there. You still have to design those ...
Posted on Sep 22 at 12:46pm by Karl Stevens
Hi, metaprog. Would you consider using C# and Visual Studio for "gluing things together and testing your IP"? Because you can define classes/objects at whatever level of detail you want, compile and run in debug mode. I do it and it works great. The are also delegates that you ...
Posted on Sep 21 at 10:19am by Steven Leibson
Those two statements do seem in conflict, Karl Stevens. "FPGA is off by an order of magnitude in performance" is with respect to an ASIC. FPGAs exhibit superior performance when compared with processors running software. That's clearly stated in the parts of those sentences that you didn't quote, but I ...
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featured blogs
Oct 15, 2021
We will not let today's gray and wet weather in Fort Worth (home of Cadence's Pointwise team) put a damper on the week's CFD news which contains something from the highbrow to the... [[ Click on the title to access the full blog on the Cadence Community site. ...
Oct 13, 2021
How many times do you search the internet each day to track down for a nugget of knowhow or tidbit of trivia? Can you imagine a future without access to knowledge?...
Oct 13, 2021
High-Bandwidth Memory (HBM) interfaces prevent bottlenecks in online games, AI applications, and more; we explore design challenges and IP solutions for HBM3. The post HBM3 Will Feed the Growing Need for Speed appeared first on From Silicon To Software....
Oct 4, 2021
The latest version of Intel® Quartus® Prime software version 21.3 has been released. It introduces many new intuitive features and improvements that make it easier to design with Intel® FPGAs, including the new Intel® Agilex'„¢ FPGAs. These new features and improvements...
Machine-Learning Optimized Chip Design -- Cadence Design Systems
New applications and technology are driving demand for even more compute and functionality in the devices we use every day. System on chip (SoC) designs are quickly migrating to new process nodes, and rapidly growing in size and complexity. In this episode of Chalk Talk, Amelia Dalton chats with Rod Metcalfe about how machine learning combined with distributed computing offers new capabilities to automate and scale RTL to GDS chip implementation flows, enabling design teams to support more, and increasingly complex, SoC projects.
Oct 14, 2021
NEUTRIK Fiber Optic Solutions
Sponsored by Mouser Electronics and Neutrik
The advantages and benefits of fiber optics are a mile long…but how can you design with them? How can you clean them? How do you repair them? Need a bit of a refresher? In this episode of Chalk Talk, Amelia Dalton chats with David Kuklinski from Neutrik about the OpticalCon advanced, OpticalCon LITE and Opticalcon DragonFly fiber optic solutions from Neutrik. They take a closer look at what benefits each of these solutions brings to the table, what kind of configurations are offered with each of these fiber optic solutions and what kind of performance you can expect when using them in your next design.
Aug 19, 2021
Seamless Ethernet to the Edge with 10BASE-T1L Technology
In order to keep up with the breakneck speed of today’s innovation in Industry 4.0, we need an efficient way to connect a wide variety of edge nodes to the cloud without breaks in our communication networks, and with shorter latency, lower power, and longer reach. In this episode of Chalk Talk, Amelia Dalton chats with Fiona Treacy from Analog Devices about the benefits of seamless ethernet and how seamless ethernet’s twisted single pair design, long reach and power and data over one cable can solve your industrial connectivity woes.
Aug 17, 2021
Flexible Power for a Smart World
Sponsored by Mouser Electronics and CUI Inc.
Safety, EMC compliance, your project schedule, and your BOM cost are all important factors when you are considering what power supply you will need for your next design. You also need to think about form factor, which capacitor will work best, and more. But if you’re not a power supply expert, this can get overwhelming in a hurry. In this episode of Chalk Talk, Amelia Dalton chats with Ron Stull from CUI Inc. about CUI PBO Single Output Board Mount AC-DC Power Supplies, what this ??ac/dc core brings to the table in terms of form factor, reliability and performance, and why this kind of solution may give you the flexibility you need to optimize your next design.
Aug 3, 2021
i.MX RT1170
Dual Core microcontrollers can bring a lot of benefits to today’s modern embedded designs in order to keep all of our design requirements in balance. In this episode of Chalk Talk, Amelia Dalton chats with Patrick Kennedy from NXP about why newer design requirements for today’s connected embedded systems are making this balancing act even harder than ever before and how the i.MX RT1170 can help solve these problems with its heterogeneous dual cores, MIPI interface, multi-core low power strategy and SRAM PUF technology can make all the difference in your next embedded design.
Aug 3, 2021
Software and Automotive Safety
In the realm of automotive designs, safety must reign above all else. But the question remains: How can we innovate within the constraints of today’s safety standards? In this episode of Chalk Talk, Amelia Dalton chats with Rob Bates from Siemens about the role ISO 26262 plays when it comes to COTS and open source software, what certified software components are all about, and how heterogeneous multiprocessing can be helpful in your next automotive design.
Jul 28, 2021