Firming Up Your Photoresist

When you spend a goodly chunk of your career dealing with EDA-like issues, as did I, then you have a pretty easy gut reaction to anything involving synthesis. See some kind of synthesis with a fancy new name? Must be some new crazy approach to generating logic circuits, right? Probably involving AI (which everything must have these days)?

Um… no. … Read More → "Firming Up Your Photoresist"

Reliability’s Road

“The road to success is paved with the hot asphalt of failure.” ― Craig D. Lounsbrough

In this week’s episode of Fish Fry, we take an in-depth look at the complex reliability issues present in today’s automotive designs. Hany Elhak (Cadence Design Systems) and I chat about the role that mixed-signal chips play in the automotive ecosystem, the reality of defect analysis in the … Read More → "Reliability’s Road"

Resurrecting 1980s Computers

“You have to fight against being an antique.” – Burt Lancaster

Constant improvement brings constant obsolescence. When we keep updating our operating systems, processors, DRAM, and applications, we also leave behind the old apps and data that we used to use.

Normally, that’s not a huge problem. Most programs are backward-compatible with their predecessors. You can … Read More → "Resurrecting 1980s Computers"

Software-Defined Manufacturing

You might say that it all started with radio. For most of us, “radio” means what you listen to in your car (where today it’s but one choice rather than the only choice it used to be). AM and FM were, and are, the main variants for that. Take TV into account, and you have VHF and UHF – if you’re receiving it over the … Read More → "Software-Defined Manufacturing"

The Communication Super Highway

Optical communication takes center stage in this week’s episode of Amelia’s Weekly Fish Fry. First up, Mark Benton (TE Connectivity) and I chat about the different levels where optics can exist in the world of electronic packaging and the how the most recent advancements in ruggedized fiber optic technology have ushered in a whole new era of box to box and PC to PC communication. Also this … Read More → "The Communication Super Highway"

May 20, 2019
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May 13, 2019
discussion
Posted on May 20 at 9:07am by Bryon Moyer
What do you think of SIS as a way of improving pattern fidelity with EUV?
Posted on May 18 at 12:19am by TotallyLost
And in the last year, more Tesla deaths ... including Tesla driving under another SemiTrailer and killing it's driver. And some statistics that didn't start with Tesla Marketing https://medium.com/@MidwesternHedgi/teslas-driver-fatality-rate-is-more-than-triple-that-of-luxury-cars-and-likely-even-higher-433670ddde17
Posted on May 13 at 10:14am by Bryon Moyer
What do you think of the notion of software-define manufacturing?
Posted on May 12 at 9:23pm by Kevin Morris
@TotallyLost - my understanding is you can kinda' do that. With Agilex, you can have chiplets with parts of your design hardened via eASIC technology connected via EMIB with FPGA fabric.
Posted on May 11 at 12:50pm by TotallyLost
Would be nice to have your cake, and eat it too ... err ... to still have some reconfigurability after locking down a core part of a design, to pick up a little speed and lower power. Like only harden 1/2 the chip
Posted on May 8 at 10:16am by mrburich
Here is one example describing Altera's HardCopy customer success from the EE Journal's archive, over ten years ago! Many other successes were proprietary to their customers. https://www.eejournal.com/article/20081125_hardcopy/
Posted on May 8 at 9:40am by mrburich
A good article, as usual at EE Journal. For the record, Altera's HardCopy was very successful for several generations and with many key customers. I am sure that experience by Intel's PSG led to the acquisition of eASIC.
Posted on May 6 at 8:54am by Bryon Moyer
What do you think of the latest in lithography from SPIE?
Posted on May 3 at 10:46am by Jim Turley
I think locking them into one cloud provider was the point.
Posted on Apr 30 at 2:50pm by TotallyLost
At the end of the day, it comes down to how many concurrent failures are required to take the system off line. A good system design will be exceptionally robust, remaining functional and safe with multiple failures. Probably as few as two failed connections in @Singer's ring design, are all ...
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featured blogs
May 20, 2019
The Loch Ness Monster? There’s that old, grainy picture. Big Foot? I’ve seen the video. UFO’s? Who knows? But micro, rugged industrial connectors? Come on, that’s really hard to believe … But, industrial electronics is Samtec'€™s largest sellin...
May 20, 2019
Next week – Wednesday 29 May – I am presenting a technical webinar, looking at multicore issue. In particular, we will be looking at a number of benefits of a multicore design including how it can help reduce certification costs and effort '€¦ Here is the abstra...
May 20, 2019
At the 2019 International Symposium of Physical Design, the conference honored Alberto Sangiovanni-Vincentelli with a lifetime achievement award. Alberto was one of the cofounders of SDA Systems, the... [[ Click on the title to access the full blog on the Cadence Community s...
Jan 25, 2019
Let'€™s face it: We'€™re addicted to SRAM. It'€™s big, it'€™s power-hungry, but it'€™s fast. And no matter how much we complain about it, we still use it. Because we don'€™t have anything better in the mainstream yet. We'€™ve looked at attempts to improve conven...
chalk talks
Enabling Next-Gen System Design: Samtec High-Speed Backplane Systems   Is your backplane getting a little long in the tooth? If you’ve been upgrading your interfaces to today’s super-high-speed standards, your backplane technology is probably getting left behind. You need to consider a high-speed, high-density, future-proofed backplane solution that can keep up with the demands of your system. In this episode of Chalk … Read More → "Enabling Next-Gen System Design: Samtec High-Speed Backplane Systems"
Sliding Power from TE Connectivity — TE Connectivity and Mouser Electronics   Power connections present a major problem for hot swapping drawers in racks. Fortunately, there are new sliding power solutions that keep your gear smoothly powered up through those drawer pulls. In this episode of Chalk Talk, Amelia Dalton chats with Brian Costello from TE Connectivity about the latest sliding power solutions. Click here … Read More → "Sliding Power from TE Connectivity — TE Connectivity and Mouser Electronics"
Transitioning to 5G — KEMET and Mouser Electronics   The transition to 5G is challenging just about every element of our system designs. Most of us spend a lot of energy worrying about high data rates, signal integrity, and RF challenges, but it’s easy to forget that the impacts of 5G extend to things like passives as well. In this episode of … Read More → "Transitioning to 5G — KEMET and Mouser Electronics"
Introduction to ESD Protection for High-Speed Data Line Interfaces — Mouser Electronics and Toshiba   ESD protection for circuits with high-speed data line interfaces can be tricky. Fine-pitch connectors like USB Type-C provide a vulnerability to the system that demands lower-capacitance ESD protection diodes. In this episode of Chalk Talk, Amelia Dalton chats with Hensen Teong from Toshiba about the latest strategies and technologies for ESD protection of … Read More → "Introduction to ESD Protection for High-Speed Data Line Interfaces — Mouser Electronics and Toshiba"
Industrial Communication Protection for RS-485 and Ethernet — Littelfuse and Mouser Electronics  Industry 4.0 brings speed, automation, efficiency… and circuit protection problems. In order to protect the RS485 and industrial Ethernet in our Industry 4.0 designs against environmental hazards such as ESD, we need industrial-grade circuit protection. In this episode of Chalk Talk, Amelia Dalton chats with Craig Morrow of Littelfuse about heavy-duty protection for Industry … Read More → "Industrial Communication Protection for RS-485 and Ethernet — Littelfuse and Mouser Electronics"
Silicon Carbide Diodes, FETs and Modules: ROHM’s Powerful Advantages and Extensive Lineup — ROHM and Mouser Electronics   Wide-bandgap materials such as silicon carbide significantly outperform silicon in numerous applications such as power. With higher voltage capability and lower conduction lose, switching applications can be much more efficient. In this episode of Chalk Talk, Amelia Dalton chats with Mitch Van Ochten from Rohm about the properties of wide-bandgap materials and how … Read More → "Silicon Carbide Diodes, FETs and Modules: ROHM’s Powerful Advantages and Extensive Lineup — ROHM and Mouser Electronics"